📍 Mountain View, CA 🏢 In Office ⏰ Full-time
AI Startup in Stealth is leading the charge in the development of high-performance, scalable, and secure data center infrastructure solutions. We deliver mission-critical technologies to enterprises, pushing the boundaries of what’s possible in large-scale distributed systems. We are seeking a highly skilled Power Module Engineer to join our team and contribute to the design and development of innovative hardware solutions, with an emphasis on packaging, thermal management, and mechanical design.
The Power Module Engineer will be responsible for the design, development, and optimization of power modules integral to our high-performance compute architecture. In this position, you will work closely with cross-functional teams, including hardware, software, and product teams, to deliver solutions that meet stringent performance, thermal, and reliability specifications for demanding compute environments.
Hardware Design: Lead the design and development of power modules with a focus on enhancing thermal performance, reducing power loss, and ensuring long-term durability under high-stress conditions.
Packaging and Thermal Management: Design advanced packaging solutions, including thermal management systems to ensure optimal performance and reliability in data centers.
Simulation: Conduct detailed thermal and electrical simulations to refine power module layouts, optimize heat dissipation pathways, and ensure compliance with industry standards.
Collaborative Engineering: Collaborate closely with cross-functional teams (mechanical, software, and systems engineering) to ensure seamless integration of power modules within larger electrical systems and drive alignment on thermal and power requirements.
Compliance and Standards: Ensure all hardware designs meet industry standards and regulatory requirements for data centers.
Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field preferred.
Bachelor’s degree with exceptional experience and track record will also be considered on a select basis.
5+ years of experience in hardware development, packaging, or mechanical design, preferably in data centers or high-performance computing environments.
Proven experience working with top-tier technology companies or innovative startups in building scalable infrastructure.
Strong expertise in hardware packaging, thermal management, and mechanical design for high-performance systems.
Proficiency with CAD software and simulation tools for thermal, stress, and structural analysis (e.g., SolidWorks, ANSYS, COMSOL), and project management tools
Demonstrated success in multi-chip module design and power packaging.
Familiarity with materials science, particularly with respect to thermal expansion, durability, and reliability in data center environments.
Strong problem-solving skills with the ability to analyze complex technical issues and design innovative solutions.
Demonstrated ability to lead technical projects, mentor junior developers, and work cross-functionally with teams.
Experience in designing hardware systems for hyperscale data centers or cloud providers.
Knowledge of high-speed signaling and power distribution in dense computing environments.
Join a team that’s shaping the future of advanced data center infrastructure.
Work on cutting-edge technologies and solve some of the most complex challenges in the industry.
Competitive salary and comprehensive benefits package.
Opportunities for career growth and professional development.
