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Boundary Spanning Service Form (Sony and e27)

This application form is part of a collaboration between Sony Acceleration Platform (SAP) and e27 to expand cross-border business matching between Japan and Southeast Asia.

Sony Acceleration Platform operates Boundary Spanning Service (BSS), a business matching platform with a network of approximately 1,900 organisations in Japan — spanning large corporates across industries such as electronics, finance, telecommunications, and real estate, as well as startups in AI, deep tech, healthcare, and more.

e27 brings its Southeast Asian startup and enterprise network to the collaboration, powered by AI-driven matchmaking capabilities.

Together, the objective of this programme is to create a more direct and structured route for Southeast Asian startups and enterprises to connect with Japanese organisations — and vice versa — for joint research and development, sales expansion, co-creation, and new business exploration.

By submitting this form, your organisation will be considered for cross-border matching opportunities through the combined BSS and e27 network.

Section 1 – Applicant Information

First Name

Last Name

Email Address

Company Name

UEN Number (Unique Entity Number)

Business Description

Department Name

Max 50 characters

Team Name

Max 40 characters

Profile/Project Title